In a significant boost to India's semiconductor ambitions, the Government of Odisha, Intel Corporation and 3DGS Inc. (USA) have signed a Memorandum of Understanding (MoU) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha.
The proposed project, with an estimated investment of around USD 3.3 billion, is among the largest high-technology manufacturing investments announced in India. The facility is planned to be set up in the Bhubaneswar-Khurda region and will be developed in phases over the next five to six years.
The facility will focus on manufacturing advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor technologies. Intel will provide technology support and process expertise, helping develop India's capabilities in advanced semiconductor packaging.
The agreement was witnessed by Union Electronics and IT Minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi and Intel CEO Lip-Bu Tan.
The project is expected to create over 1,800 direct high-skilled jobs, besides generating substantial indirect employment opportunities across the semiconductor and technology ecosystem.
The development aligns with India's broader semiconductor strategy under the India Semiconductor Mission and is expected to strengthen the country's manufacturing capabilities, supply chain ecosystem and export potential in the semiconductor sector.